Low corrosion plating
We offer NiPdAu plating that reduces corrosion! Leave the optimization of the pretreatment to us.
We would like to introduce our "low corrosion plating" treatment. By applying palladium plating between nickel and gold to reduce the substitution reaction, we offer NiPdAu plating that mitigates corrosion. With the increasing miniaturization, lightweight, and thinness of electronic devices due to their enhanced functionality and multi-functionality, products with narrow line/space (L/S) are on the rise. We propose and accommodate the optimization of pretreatment tailored to the products as a pre-plating process. 【Processing Steps】 ■Step 1. Pretreatment & Masking: Cleaning and smoothing of the copper surface ■Step 2. Plating Treatment: Electroless, electrolytic, and selective plating ■Step 3. Rinsing and Drying: Final pure cleaning *For more details, please download the PDF or feel free to contact us.
- Company：塚田理研工業
- Price：Other
